Driver Warning Safety/Security :: Altera Fuels Its Automotive Electronics Portfolio

Providing a platform for innovation in the automotive electronics market, Altera Corporation (NASDAQ: ALTR) has announced that it will begin shipping automotive-grade devices for selected members...  >>  

Electronic Imaging :: Zoran’s APPROACH 5C Multimedia Processor Powers LG’s Secret Black Label Phone With High Quality Image Capture

Zoran announces that its APPROACH 5C multimedia processor powers LG’s Secret (model LG-KF750), the newest and third handset of the Black Label Series, 5 megapixel camera phone.  >>  

Cameras/Camcorders :: Aptina Introduces New Feature-Rich ISP Companion Chip

Aptina Imaging announced today the launch of its new image signal processor (ISP) companion chip, MT9S311. The new ISP was designed to provide users with greater compatibility with Aptina’s...  >>  

Mobile Multimedia Platforms/Components :: ARM SoC Designer – Final Release v7.1 is Now Available

ARM has announced the availability of SoC Designer version 7.1. This release provides several new benefits and enhancements and is the last release made by ARM. As per the agreement with Carbon...  >>  

Military/Aerospace Avionics :: Actel Expands Military-Qualified Flash-Based FPGA Offerings

Actel Corporation has announced it has added new ProASIC®3 and ProASIC®3EL FPGAs to its military-qualified product offerings. Verified to operate across the full military temperature...  >>  

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Mobile Handsets :: Bucking the Trend: When Discrete Solutions can be Better than Integration

By Alex Lloyd, Axiom Microdevices, Inc. Irvine, Calif. Conventional wisdom has it that increasing levels of integration bring benefits in terms of reduced cost, size and increased reliability.  >>  

Notebook PC Hardware :: Real Cost of Solid State Drives

by Steve Weinger, Samsung Semiconductor, Inc. Solid state drives (SSDs) are popping up everywhere. Dell, Lenovo, Sony and Toshiba are just some of the notebook PC OEMs who are now offering SSDs. A growing number of IT managers around the globe as well have been looking at the SSD option for notebooks in corporate networks.  >>  

Zigbee :: RF in the Piazza – Novice’s Guide for Bringing Applications to Market

By David Bourner, Micrel Corp. Until quite recently, I taught a senior undergraduate projects course in computer engineering. One of the paragons of the course involved students discovering and using engineering standards to help successfully tackle a two-semester long design project. After three years of study in the computer engineering program, my students had the basis to “pick...  >>  

Everything Is Going Green with White Goods

By Tony Armstrong, Linear Technology Corp. The popularization of the concept of “Green Environment Protection” has been in the news a great deal during recent months. As a result, many power management IC suppliers have made a lot of progress in improving power efficiency.  >>  

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CAN, LIN, MOST, FlexRay :: Atmel Introduces a Family of AVR Microcontrollers for Automotive LIN Networking Applications

Atmel announced the availability of a new family of AVR 8-bit microcontrollers for LIN Automotive networking applications. The ATtiny167 is the first device and is optimized to LIN slave... [from Atmel]  >>  

Phoneline-based Networking :: Xilinx Spartan-II FPGAs Enable HomePNA-Based Solutions

This paper is a comprehensive document on Home networking with special emphasis on phoneline home networking. It discusses the industry initiated consortiums – HomePNA (Phoneline Networking... [from Xilinx]  >>  

RAID :: Oxford Semiconductor Unveils New Consumer Network-Attached and Direct-Attached Storage Solution-on-a-chip Platforms

Oxford Semiconductor, provider of silicon and software solutions designed to simplify digital storage and retrieval, today unveiled the latest additions to its family of storage platforms that... [from Oxford Semiconductor]  >>  

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Satellite Access Application Notes :: Introducing Stratix III FPGAs—Optimized for Broadcast Applications

The latest generation of Altera® high-end FPGAs, the Stratix® III device family provides 50% lower power, 25% better performance and 2X the density of previous families. Leverage Stratix...  >>  

CoAx Networking White Papers :: Hybrid Coax-Wireless Multimedia Home Networks

As the demand for capacity in the home network increases, the coverage of the wireless connection may limit operators’ ability to offer new bandwidth intensive services and applications such...  >>  

HDMI/DVI Application Notes :: HDMI Transmitter/Receiver Support on TMS320DM6467

This application report describes how to equip the DM6467 device with transmit/receive capabilities via high-definition multimedia interface (HDMI). A general description is provided for all the...  >>  

CoAx Networking Application Notes :: HPNA over Coax application note

The purpose of this document is to serve as a handbook for the design and installation of HPNA 3.0 products over coax media and over mixed phone/coax media. Section 1 gives general information and...  >>  

HDMI/DVI White Papers :: WHDI™ - Wireless High Definition Interface

WHDI™ - Wireless High Definition Interface sets a new standard for wireless high-definition video connectivity. It provides a high-quality, uncompressed wireless link which can support...  >>  

802.11x White Papers :: 10G EPON Brings Advantages to the Fiber Access Network

As the deployment of Fiber to the Home (FTTH) technologies in the access network accelerates, vendors and technology innovators are looking ahead to solve next-generation applications'...  >>  

[MORE APPLICATION RESOURCES ]

Solid State Lighting :: New LinkSwitch-II Design Ideas from Power Integrations Make Driving LEDs Simple

Power Integrations, announced a series of design ideas to help designers of LED driver circuitry benefit from the company's recently introduced LinkSwitch-II family of AC-DC power conversion...  >>  

DC/DC Power Conversion :: TI unveils industry's thinnest 500-mA power converter solution

Giving portable designers the ability to add more features and functions on a handheld device, Texas Instruments announced the industry's smallest and thinnest 500-mA, step-down DC/DC...  >>  

DC/DC Power Conversion :: MCP1630 Li-Ion Multi Bay Battery Charger Reference Design

The MCP1630 Multi-Bay Li-Ion Charger is used to evaluate Microchip’s MCP1630 used in a SEPIC power converter application.  >>  

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Lighting :: Cypress Webinar Gives Designers Overview And Design Tips On Communication Interfaces For Intelligent Lighting Networks

Cypress Semiconductor Corp. announced a free online seminar that reviews communication interfaces for intelligent lighting networks and presents tools to simplify the design process.  >>  

Sensor Signal Conditioning :: NEC Electronics America Shares Tips for Developing Low-Cost Custom Silicon for the Industrial Market

Engineers working in the industrial market face a number of critical design challenges to support low power consumption, device security and long life cycles while delivering low-cost, highly...  >>  

Motor and Motion Control :: Providing Reliable and Accurate Motor Control Systems with Isolation Solutions

In a high electrical noise and hazardous voltage environment of motor control system, designers face challenges in achieving system reliability, accuracy and smooth communication within industrial...  >>  

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Solid State Lighting :: Toshiba Introduces High Power, High Flux 90 Lumen White Led

Toshiba announced TL12W02-D, a new high power, high brightness white LED for commercial, residential and industrial lighting applications that can provide a typical flux of 90 lumens (lm) when...  >>  

HDMI/DVI :: TI introduces flexible, eight-channel ESD solution for HDMI and DisplayPort

Texas Instruments introduced a robust electrostatic discharge (ESD) solution that provides system-level ESD protection for eight high-speed differential lines, designed specifically for...  >>  

Handheld/PDA/Palmtop :: TI introduces complete audio subsystem for portable devices

Texas Instruments introduced an analog-input audio subsystem that integrates TI's field-proven stereo Class-D power amplifier and stereo DirectPath headphone amplifier into one compact package.  >>  

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